Introduced CM-X270, advanced successor for popular CM-X255.
Introduced CM-iVCF, CoM based on VIA’s CPU. This module covers demands of mid-range to high-end applications.
Introduced CM-F82 based on Power PC architecture.
Introduced new baseboard concept comprising standard PC/104+ form factor and an optional front panel.
Started new assembling line, with over $2M accumulative investment. All assembling was moved in-house.